Thermal Modules (Air Cooling): Companies by Annual-Report Disclosure
Every company below discloses thermal modules (air cooling) as its own product in its annual report — placements are quoted verbatim from the filings, never inferred from industry lists or news.
Thermal Modules (Air Cooling): companies placed by annual-report disclosure
| Code | Company | Annual-report source (original language) |
|---|---|---|
| 2354 | 🇹🇼 FTC | 散熱模組：5G產品、物聯網、桌上型電腦、筆電、手機、平，板電腦、伺服器、工作站、資料中心、遊戲機、 Source: 2354 FY2024 annual report (Chinese original) |
| 2402 | 🇹🇼 ICHIA | 散熱模組：智慧相關技術、工業控制、攜帶式裝置與光通訊等，皆可運用。 Source: 2402 FY2024 annual report (Chinese original) |
| 2421 | 🇹🇼 SUNON | 建準產業應用廣泛，是全球主流產業的散熱頂尖供應商之一，可提供完 整的散熱風扇、散熱模組及液冷系統，滿足產業最先進的技術散熱需求。 Source: 2421 FY2024 annual report (Chinese original) |
| 2486 | 🇹🇼 I-CHIUN | 散熱元件 Source: 2486 FY2025 annual report (Chinese original) |
| 3017 | 🇹🇼 AVC | 本公司產製散熱產品所需之主要原料包括銅材、鋁材、鋼材、塑膠製品，以 及 Sensor、IC 及培林等組件。 Source: 3017 FY2025 annual report (Chinese original) |
| 3071 | 🇹🇼 ADDA | 可提供無鉛及符合 RoHS 規範的散熱風扇及散熱器 Source: 3071 FY2024 annual report (Chinese original) |
| 3236 | 🇹🇼 ABC | MPC陶瓷散熱片：散熱、防止EMI： Source: 3236 FY2024 annual report (Chinese original) · not repeated in the latest annual report |
| 3324 | 🇹🇼 AURAS | 本公司主要產品為散熱模組，其主要應用於筆記型桌上型電腦、手持裝置 及顯示卡等產品使用。 Source: 3324 FY2024 annual report (Chinese original) |
| 3338 | 🇹🇼 TAISOL | 2.散熱模組( Heat Sink + Heat pipe ) Source: 3338 FY2024 annual report (Chinese original) |
| 3483 | 🇹🇼 FCN | 公司擁有多元產品組合，包括散熱器、風扇、散熱片、熱導管及散熱模組 Source: 3483 FY2024 annual report (Chinese original) |
| 3653 | 🇹🇼 JENTECH | 散熱產品：為高階封裝、半導體元件、馬達、逆變器提供散熱功能。： Source: 3653 FY2024 annual report (Chinese original) |
| 4912 | 🇹🇼 Lemtech-KY | 產品應用範圍包含雲儲存、筆記型及桌上型電腦散熱片、散熱零組件、手機遮罩、 電腦伺服器支架等 3C 電子 Source: 4912 FY2024 annual report (Chinese original) |
| 6230 | 🇹🇼 NCCI | 本公司主要生產的熱導管、散熱片及散熱模組等產品，主要係運用於筆記型電 Source: 6230 FY2024 annual report (Chinese original) |
| 6275 | 🇹🇼 Y.S.TECH | 主要產品為直流無刷散熱與通風風扇、散熱模組、水冷散熱系統。主 Source: 6275 FY2024 annual report (Chinese original) |
| 6831 | 🇹🇼 MICROLOOPS | 本公司之產品主要為散熱模組 Source: 6831 FY2024 annual report (Chinese original) |
Placement is based on each company's own product disclosures — not industry knowledge or market commentary. Nothing is inferred; if the filings don't say it, the company isn't listed.
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FAQ
How is the Thermal Modules (Air Cooling) company list decided?
Every company comes from a product disclosure in its own annual report — the right-hand column quotes the original filing verbatim, with the fiscal year. Nothing is added from industry lists, analyst reports or news: a company that everyone "knows" makes this will still be absent if its filings never say so.
Is this list complete?
No guarantee of completeness. Coverage is limited to the filings this site has collected and extracted, and disclosure wording varies by company — only sufficiently specific language gets placed. Every listed company has a source; an absent one may simply not be covered yet.
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