DRAM Stocks: Taiwan Memory Supply Chain Map
End-to-end view of the supply chain: 10 items and 14 Taiwan-listed companies. A company's placement is determined by the products disclosed in its own annual report. Click an item for companies and excerpts; click an edge for the source of that relation. Data: FY2024 annual report, FY2025 annual report, FY2025 annual report.
👆 Click an item to see its companies and annual-report sources; click an edge to see where the relation comes from.
Upstream items & companies
Silicon WaferL4・Upstream
No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.
Core items & companies
DRAM ChipsL2・Core
- 🇹🇼 WEC（2344） — 「行動記憶體（Mobile Memory）：主要應用在低階邊緣人工智慧（Edge AI）運算裝置」 Source: 2344 FY2025 annual report (Chinese original), section starting p.79
- 🇹🇼 NTC（2408） — 「本公司主要的產品為動態隨機存取記憶體(DRAM)，主要用途為存 放運算資料，其應用範圍相當廣泛，舉凡智慧手機、伺服器、個人電」 Source: 2408 FY2025 annual report (Chinese original), section starting p.101
- 🇹🇼 ESMT（3006） — 「動能隨機存取記憶體SDRAM、PSRAM、MobileSDRAM/」 Source: 3006 FY2025 annual report (Chinese original), section starting p.81
- 🇹🇼 ADATA（3260） — 「利基型記憶體・應用於記憶體模組、DVD Player、數位相機、Set-Top Box、LCDMonitor、ADSL、VDSL、CDRW、VGA卡、I」 Source: 3260 FY2025 annual report (Chinese original), section starting p.92
- 🇹🇼 Etron（5351） — 「鈺創・DRAM・SDR」 Source: 5351 FY2025 annual report (Chinese original), section starting p.62
- 🇹🇼 AP Memory（6531） — 「本公司現行產品組合包括 Pseudo SRAM 、低功 耗 DRAM ，以及 3D 堆疊異質整合技術為核心之 VHM™ 系列解決方案」 Source: 6531 FY2025 annual report (Chinese original), section starting p.62
High Bandwidth Memory (HBM)L2・Core
- 🇹🇼 WEC（2344） — 「客製化高頻寬記憶體及元件: 主要應用於各種不同邊緣人工智慧(Edge AI)運算」 Source: 2344 FY2025 annual report (Chinese original), section starting p.79
- 🇹🇼 AP Memory（6531） — 「本公司發展之 3D 堆 疊異質整合（ Wafer-on-Wafer ）記憶體技術架構，以及 VHM™ 、 VHMStack™ 與 VHMInterposer™ 系列產品」 Source: 6531 FY2025 annual report (Chinese original), section starting p.62
NAND Flash ChipsL2・Core
- 🇹🇼 Macronix（2337） — 「快閃記憶體(Flash Memory)」 Source: 2337 FY2025 annual report (Chinese original), section starting p.93
- 🇹🇼 Etron（5351） — 「SPI NANDFlash」 Source: 5351 FY2025 annual report (Chinese original), section starting p.62
NOR Flash ChipsL2・Core
- 🇹🇼 Macronix（2337） — 「本公司 NOR Flash 產品線 114 年市佔率約為 16.9% ，持續位居全球非揮發 性記憶體整合元件領導廠商」 Source: 2337 FY2025 annual report (Chinese original), section starting p.93
- 🇹🇼 WEC（2344） — 「應用遍及個人電腦及其周邊產品、行動手持裝置及其周邊產品模組、網通產品、物聯網、消費性電 子、車用及工業電子及家電模組等領域」 Source: 2344 FY2025 annual report (Chinese original), section starting p.79
- 🇹🇼 ESMT（3006） — 「NOR型快閃記憶體(FlashMemory)」 Source: 3006 FY2025 annual report (Chinese original), section starting p.81
Downstream items & companies
IC Packaging & Testing (OSAT)L3・Downstream
- 🇹🇼 OSE（2329） — 「將持續投入 CSP BGA 市場的開發及生產效率的提升，除了持續深 耕記憶體市場 ( 尤其是 LPDDR 及 DDR)」 Source: 2329 FY2025 annual report (Chinese original), section starting p.93
- 🇹🇼 PTI（6239） — 「目前在 DRAM 、 NAND FLASH 之記憶體及邏輯 IC 之封測代工呈現約略各占 1/2 之態勢」 Source: 6239 FY2025 annual report (Chinese original), section starting p.80
- 🇹🇼 ChipMOS（8150） — 「覆晶封裝技術（ Flip Chip ）」 Source: 8150 FY2025 annual report (Chinese original), section starting p.88
Memory Modules (DIMM)L1・Downstream
- 🇹🇼 Transcend（2451） — 「記憶體模組亦為本公司另一主要產品」 Source: 2451 FY2025 annual report (Chinese original), section starting p.71
- 🇹🇼 ADATA（3260） — 「記憶體模組・應用於桌上型電腦、筆記型電腦、工作站、伺服器、雲端與資料中心設備、邊緣運算設備、AI PC及AI伺服器、網通設備、NAS儲存設備、嵌」 Source: 3260 FY2025 annual report (Chinese original), section starting p.92
- 🇹🇼 TEAM（4967） — 「記憶體模組」 Source: 4967 FY2025 annual report (Chinese original), section starting p.66
- 🇹🇼 Silicon Power（4973） — 「工業用記憶體模組(Flash/DRAM)・應用於不同企業領域需求之特殊規格系統裝置。」 Source: 4973 FY2025 annual report (Chinese original), section starting p.76
Solid State Drives (SSD)L1・Downstream
- 🇹🇼 OSE（2329） — 「(3) SSD 卡及 DDR 產品需求持續增加。」 Source: 2329 FY2025 annual report (Chinese original), section starting p.93
- 🇹🇼 Macronix（2337） — 「嵌入式多媒體卡(eMMC)」 Source: 2337 FY2025 annual report (Chinese original), section starting p.93
- 🇹🇼 Transcend（2451） — 「創見推出許多符合各種不同工 業應用之儲存產品，如 Portable SSD 、快閃記憶模組及工規 CF/SD 記憶卡等」 Source: 2451 FY2025 annual report (Chinese original), section starting p.71
- 🇹🇼 ADATA（3260） — 「固態硬碟・應用於平板電腦、桌上型電腦、筆記型電腦、遊戲機、企業級伺服器、工業電腦、雲端伺服器，並針對不同應用面提供不同介面與尺寸的存取記憶體解決」 Source: 3260 FY2025 annual report (Chinese original), section starting p.92
- 🇹🇼 TEAM（4967） — 「固態硬碟 : 應用於電競專用電腦、創作者專用電腦、桌上型電腦、筆記型電腦及」 Source: 4967 FY2025 annual report (Chinese original), section starting p.66
- 🇹🇼 Silicon Power（4973） — 「外接式硬碟產品・作為電腦系統之外接存取裝置。」 Source: 4973 FY2025 annual report (Chinese original), section starting p.76
- 🇹🇼 Etron（5351） — 「e.MMC應用於大容量儲存」 Source: 5351 FY2025 annual report (Chinese original), section starting p.62
- 🇹🇼 PTI（6239） — 「- (29) 高容量固態硬碟 (High Density SSD up to 122TB): SFF / EDSFF」 Source: 6239 FY2025 annual report (Chinese original), section starting p.72
- 🇹🇼 Phison（8299） — 「本集團除自行開發 NAND Flash 控制 IC 及從事 SSD 、快閃記憶體模組 產品等應用成品設計外」 Source: 8299 FY2025 annual report (Chinese original), section starting p.81
Memory Cards & USB DrivesL1・Downstream
- 🇹🇼 OSE（2329） — 「針對快閃記憶卡之主要關鍵零組件，包括快閃記憶體及記憶體控制晶片」 Source: 2329 FY2024 annual report (Chinese original), section starting p.86
- 🇹🇼 Transcend（2451） — 「創見推出許多符合各種不同工 業應用之儲存產品，如 Portable SSD 、快閃記憶模組及工規 CF/SD 記憶卡等」 Source: 2451 FY2025 annual report (Chinese original), section starting p.71
- 🇹🇼 ADATA（3260） — 「消費性快閃記憶體應用產品・應用於各式行動裝置所需之小型快閃記憶卡、桌上型電腦或筆記型電腦交換資料用之快閃記憶隨身碟。」 Source: 3260 FY2025 annual report (Chinese original), section starting p.92
- 🇹🇼 TEAM（4967） — 「隨身碟 : 桌上型電腦或筆記型電腦及行動裝置之擴充容量及交換資料用」 Source: 4967 FY2025 annual report (Chinese original), section starting p.66
- 🇹🇼 Silicon Power（4973） — 「快閃記憶體產品・作為連接電腦系統之外接記憶體存取裝置；或複合式功能作為資料儲存、影音拍攝與播放之多功能裝置。」 Source: 4973 FY2025 annual report (Chinese original), section starting p.76
- 🇹🇼 Phison（8299） — 「本公司主要產品為快閃記憶體控制晶片以及快閃記憶體模組產品、快閃記憶卡」 Source: 8299 FY2025 annual report (Chinese original), section starting p.86
AI ServersL0・Downstream
No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.
FAQ
Which listed companies are DRAM stocks plays?
Based on each company's own annual report disclosures, this map currently places 14 Taiwan-listed companies: OSE（2329）、Macronix（2337）、WEC（2344）、NTC（2408）、Transcend（2451）、ESMT（3006）、ADATA（3260）、TEAM（4967）、Silicon Power（4973）、Etron（5351）、PTI（6239）、AP Memory（6531）、ChipMOS（8150）、Phison（8299）. A company's position is determined by the products its annual report says it makes — with the original excerpt cited.
Which Taiwan stocks make DRAM?
The map's DRAM node lists every Taiwan-listed company whose own annual report discloses DRAM chip production — click the node to see each company with the original disclosure excerpt. Taiwan's memory sector also spans specialty DRAM designers, module makers and memory-focused OSATs, each on its own node.
Which companies are HBM stocks in Taiwan?
HBM (High Bandwidth Memory) is a separate node on the map. Taiwan's exposure is mostly customized high-bandwidth parts rather than mainstream HBM stacks — the node shows exactly which listed companies disclose such products, with sources. This is a factual map from annual reports, not investment advice.
Where does the data on this map come from?
Two sources, styled differently on the map: relations tagged with a stock code are extracted from that company's annual report (click an edge to see the original Chinese excerpt and page); the backbone chain is an editorial framework that keeps the chain connected end-to-end. Company placements come 100% from disclosures — nothing is inferred.
Why do some items show no companies?
Dashed items have no collected annual-report disclosure yet — the segment may be dominated by non-Taiwan or unlisted players, or simply not yet covered. We deliberately distinguish "no companies" from "not yet covered".
Back to Taiwan annual reports。