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PCB Stocks: Taiwan PCB, Substrate & CCL Supply Chain Map

End-to-end view of the supply chain: 13 items and 12 Taiwan-listed companies. A company's placement is determined by the products disclosed in its own annual report. Click an item for companies and excerpts; click an edge for the source of that relation. Data: FY2024 annual report, FY2025 annual report, FY2025 annual report.

Core Upstream Downstream No disclosure yet Backbone (editorial) Extracted from annual reports (click an edge)
L4 Raw Materials & Substrates L3 Epi / Fab / OSAT L1 Modules & Engines L0 End Systems AI Server DC Switch Transceivers OSAT PCB 8 companies LEO Satellite Ground Equip. DIMM SSD CCL 3 companies IC Substrate 3 companies Cu Foil Glass Fabric 1 company
L4 Raw Materials & Substrates L3 Epi / Fab / OSAT L1 Modules & Engines L0 End Systems AI Server DC Switch Transceivers OSAT PCB 8 companies LEO Satellite Ground Equip. DIMM SSD CCL 3 companies IC Substrate 3 companies Cu Foil Glass Fabric 1 company

👆 Click an item to see its companies and annual-report sources; click an edge to see where the relation comes from.

Upstream items & companies

Copper FoilL4・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Fiberglass FabricL4・Upstream

  • 🇹🇼 BAOTEK(5340) — 「玻纖布除持續大宗 布的供應外,將繼續高開纖布、耐 CAF 布及極低膨脹係數( Low CTE )布之精進」 Source: 5340 FY2025 annual report (Chinese original), section starting p.54

Core items & companies

Copper Clad Laminate (CCL)L3・Core

  • 🇹🇼 EMC(2383) — 「本公司為全球無鹵素 CCL 龍頭,市占率達 34.4」 Source: 2383 FY2025 annual report (Chinese original), section starting p.77
  • 🇹🇼 ITEQ(6213) — 「為多層印刷電路板前段製程,自內層線路、製作乾膜至壓合成型」 Source: 6213 FY2025 annual report (Chinese original), section starting p.80
  • 🇹🇼 tuc(6274) — 「為多層印刷電路板前段製程,自內層線路乾膜製作至壓合成型。」 Source: 6274 FY2025 annual report (Chinese original), section starting p.97

Printed Circuit Board (PCB)L3・Core

  • 🇹🇼 COMPEQ(2313) — 「軟板、軟硬接合板及SMT」 Source: 2313 FY2025 annual report (Chinese original), section starting p.65
  • 🇹🇼 CHIN-POON(2355) — 「(2)雙面及多層印刷電路板」 Source: 2355 FY2025 annual report (Chinese original), section starting p.160
  • 🇹🇼 GCE(2368) — 「本公司係專業印刷電路板之生產製造商」 Source: 2368 FY2025 annual report (Chinese original), section starting p.91
  • 🇹🇼 UNIMICRON(3037) — 「汽車板以及高層數電路板產品之技術能力」 Source: 3037 FY2025 annual report (Chinese original), section starting p.67
  • 🇹🇼 Tripod(3044) — 「印刷電路板・PC及其週邊等資訊產品、通訊產品、工業儀器、消費性電子產品、汽車用板等」 Source: 3044 FY2025 annual report (Chinese original), section starting p.40
  • 🇹🇼 ZDT(4958) — 「高密度連接板・體積小、電路分布密度高、傳輸效能佳」 Source: 4958 FY2024 annual report (Chinese original), section starting p.45
  • 🇹🇼 YUFO(6194) — 「多層板・通訊週邊、電腦週邊設備、電競類產品、智能家居產品、顯示卡、智能交」 Source: 6194 FY2025 annual report (Chinese original), section starting p.54
  • 🇹🇼 N.P.C(8046) — 「為各項電子設備中的關鍵零組件,其用途乃做為各電子」 Source: 8046 FY2025 annual report (Chinese original), section starting p.105

IC Substrate (ABF/BT)L3・Core

  • 🇹🇼 UNIMICRON(3037) — 「提供全方位產品 - 載板、類載板、 HDI 板、軟硬複合板、多層板及軟板。」 Source: 3037 FY2025 annual report (Chinese original), section starting p.67
  • 🇹🇼 ZDT(4958) — 「IC 載板・更輕、體積更小,主要功能為承載IC 做為載體之用途」 Source: 4958 FY2024 annual report (Chinese original), section starting p.45
  • 🇹🇼 N.P.C(8046) — 「應用於IC 晶片(Chip)產品之承載,使得晶片的輸出及」 Source: 8046 FY2025 annual report (Chinese original), section starting p.105

Downstream items & companies

IC Packaging & Testing (OSAT)L3・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Optical TransceiversL1・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Memory Modules (DIMM)L1・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Solid State Drives (SSD)L1・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Satellite Ground EquipmentL1・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

AI ServersL0・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Data Center SwitchesL0・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

LEO SatellitesL0・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

FAQ

Which listed companies are PCB stocks plays?

Based on each company's own annual report disclosures, this map currently places 12 Taiwan-listed companies: COMPEQ(2313)、CHIN-POON(2355)、GCE(2368)、EMC(2383)、UNIMICRON(3037)、Tripod(3044)、ZDT(4958)、BAOTEK(5340)、YUFO(6194)、ITEQ(6213)、tuc(6274)、N.P.C(8046). A company's position is determined by the products its annual report says it makes — with the original excerpt cited.

Which Taiwan stocks make ABF substrates?

IC substrates (ABF and BT) are a separate node on the map, distinct from conventional PCBs — similar process, different customers (chip packaging vs. system assembly). Click the IC Substrate node to see which listed companies disclose substrate production, each with the original annual-report excerpt.

Where does the data on this map come from?

Two sources, styled differently on the map: relations tagged with a stock code are extracted from that company's annual report (click an edge to see the original Chinese excerpt and page); the backbone chain is an editorial framework that keeps the chain connected end-to-end. Company placements come 100% from disclosures — nothing is inferred.

Why do some items show no companies?

Dashed items have no collected annual-report disclosure yet — the segment may be dominated by non-Taiwan or unlisted players, or simply not yet covered. We deliberately distinguish "no companies" from "not yet covered".

Compiled from public annual-report disclosures for research and educational reference only — not investment advice or stock recommendations. The backbone chain is an editorial framework; company placements and code-tagged relations cite annual-report originals (in Chinese). Disclosures reflect their reporting period (FY2024 annual report, FY2025 annual report, FY2025 annual report) and not current operations.
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