IC Substrate (ABF/BT): Companies by Annual-Report Disclosure
Every company below discloses ic substrate (abf/bt) as its own product in its annual report — placements are quoted verbatim from the filings, never inferred from industry lists or news.
IC Substrate (ABF/BT): companies placed by annual-report disclosure
| Code | Company | Annual-report source (original language) |
|---|---|---|
| 3037 | 🇹🇼 UNIMICRON | 提供全方位產品 - 載板、類載板、 HDI 板、軟硬複合板、多層板及軟板。 Source: 3037 FY2025 annual report (Chinese original) |
| 3189 | 🇹🇼 KINSUS | (10) 埋入式線路載板生產技術與產品 Source: 3189 FY2024 annual report (Chinese original) |
| 4958 | 🇹🇼 ZDT | IC 載板：更輕、體積更小，主要功能為承載，IC 做為載體之用途 Source: 4958 FY2024 annual report (Chinese original) |
| 8046 | 🇹🇼 N.P.C | 應用於IC 晶片(Chip)產品之承載，使得晶片的輸出及 Source: 8046 FY2024 annual report (Chinese original) |
| 4062 | 🇯🇵 IBIDEN CO.,LTD. | と当該事業における位置付けは、次のとおりであります。 区分 主要製品及び事業内容 主要な会社 電子 パッケージ基板 当社 イビデン樹脂㈱ イビデン産業㈱ イビデンU.S.A.㈱(米国) イビデンシンガポール㈱(シンガ Source: 4062 FY2026 annual securities report (Japanese original) |
Placement is based on each company's own product disclosures — not industry knowledge or market commentary. Nothing is inferred; if the filings don't say it, the company isn't listed.
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FAQ
How is the IC Substrate (ABF/BT) company list decided?
Every company comes from a product disclosure in its own annual report — the right-hand column quotes the original filing verbatim, with the fiscal year. Nothing is added from industry lists, analyst reports or news: a company that everyone "knows" makes this will still be absent if its filings never say so.
Is this list complete?
No guarantee of completeness. Coverage is limited to the filings this site has collected and extracted, and disclosure wording varies by company — only sufficiently specific language gets placed. Every listed company has a source; an absent one may simply not be covered yet.
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