IC Packaging & Testing (OSAT): Companies by Annual-Report Disclosure
Every company below discloses ic packaging & testing (osat) as its own product in its annual report — placements are quoted verbatim from the filings, never inferred from industry lists or news.
IC Packaging & Testing (OSAT): companies placed by annual-report disclosure
| Code | Company | Annual-report source (original language) |
|---|---|---|
| 2329 | 🇹🇼 OSE | 將持續投入 CSP BGA 市場的開發及生產效率的提升，除了持續深耕 記憶體市場 ( 尤其是 LPDDR 及 DDR) Source: 2329 FY2024 annual report (Chinese original) |
| 2330 | 🇹🇼 TSMC | 完成認證CoWoS<sup>®</sup> 先進封裝解決 方案在5.5倍光罩尺寸中介層的認證 Source: 2330 FY2025 annual report (Chinese original) |
| 3189 | 🇹🇼 KINSUS | Flipchip：應用之產品為晶片組、繪圖晶片、快閃記憶體、邏輯IC Source: 3189 FY2024 annual report (Chinese original) |
| 3264 | 🇹🇼 Ardentec | 成品測試服務 Source: 3264 FY2025 annual report (Chinese original) |
| 3265 | 🇹🇼 WST | 測試服務－積體電路測試，(Final Test)： Source: 3265 FY2024 annual report (Chinese original) |
| 3450 | 🇹🇼 ELASER | 功率半導體封裝及測試：AC/DC，DC/DC之交換式整流、轉換器之功能及 Source: 3450 FY2024 annual report (Chinese original) |
| 3567 | 🇹🇼 ETREND | 測試服務－積體電路測，試(Final Test)：以精密之高科技術機器設備，依客戶指定之測試條 Source: 3567 FY2024 annual report (Chinese original) |
| 6147 | 🇹🇼 CHIPBOND | 無鉛凸塊產品之研發 Source: 6147 FY2024 annual report (Chinese original) |
| 6239 | 🇹🇼 PTI | 目前在 DRAM 、 NAND FLASH 之記憶體及邏輯 IC 之封測代工呈現約略各占 1/2 之態勢 Source: 6239 FY2024 annual report (Chinese original) |
| 6257 | 🇹🇼 SIGURD | Package)，如WLCSP Source: 6257 FY2024 annual report (Chinese original) |
| 6261 | 🇹🇼 YTEC | 主要確認半導體元件功能、速度、容忍度、電子消耗、電子，放射等屬性是否符合標準。 Source: 6261 FY2024 annual report (Chinese original) |
| 6525 | 🇹🇼 GEM | 功率半導體封裝及測試 Source: 6525 FY2024 annual report (Chinese original) |
| 7734 | 🇹🇼 APT | 本公司致力於提供領先的半導體製程解決方案，涵蓋關鍵設備如壓力除泡烤 箱、高功率老化測試機及封測製程自動化系統 Source: 7734 FY2024 annual report (Chinese original) |
| 8110 | 🇹🇼 WALTON | Flip-Chip( 覆晶封裝 ) Source: 8110 FY2024 annual report (Chinese original) |
| 8131 | 🇹🇼 FATC | 0P1M(無PI 降低成本)覆晶封裝/測試試驗案 Source: 8131 FY2024 annual report (Chinese original) |
| 8150 | 🇹🇼 ChipMOS | 本公司為專業之 IC 封裝測試公司，主要為 IC 設計公司、整合元件製造公 司及 IC 晶圓廠提供記憶體 IC 、 LCD 驅動 IC 及邏輯 / 混合訊號產品之封裝測試服 務 Source: 8150 FY2024 annual report (Chinese original) |
| AMKR | 🇺🇸 AMKOR TECHNOLOGY, INC. | Test Development Services: Prior to mass production, an integrated manufacturing ready test solution must be d… Source: AMKR FY2025 annual report (10-K/20-F) |
| MRAM | 🇺🇸 EVERSPIN TECHNOLOGIES INC. | We derive our revenue from the sale of MRAM-based products in discrete unit form, licenses of and royalties on… Source: MRAM FY2025 annual report (10-K/20-F) |
| 6635 | 🇯🇵 Di-Nikko Engineering Co.,Ltd. | 電子部品実装（ロボット及び人間による手作業）を行うものであり Source: 6635 FY2025 annual securities report (Japanese original) |
| SWKS | 🇺🇸 SKYWORKS SOLUTIONS, INC. | System In Package: complete system in a package, including modem, RF front-end, filtering, matching, timing ge… Source: SWKS FY2025 annual report (10-K/20-F) |
Placement is based on each company's own product disclosures — not industry knowledge or market commentary. Nothing is inferred; if the filings don't say it, the company isn't listed.
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FAQ
How is the IC Packaging & Testing (OSAT) company list decided?
Every company comes from a product disclosure in its own annual report — the right-hand column quotes the original filing verbatim, with the fiscal year. Nothing is added from industry lists, analyst reports or news: a company that everyone "knows" makes this will still be absent if its filings never say so.
Is this list complete?
No guarantee of completeness. Coverage is limited to the filings this site has collected and extracted, and disclosure wording varies by company — only sufficiently specific language gets placed. Every listed company has a source; an absent one may simply not be covered yet.
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