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Silicon Photonics Stocks: Taiwan Co-Packaged Optics Supply Chain Map

End-to-end view of the supply chain: 17 items and 19 listed companies (Taiwan-listed 15, US-listed 4). A company's placement is determined by the products disclosed in its own annual report. Click an item for companies and excerpts; click an edge for the source of that relation. Data: FY2024 annual report, FY2025 annual report, FY2025 annual report, FY2026 annual report.

Core Upstream Downstream No disclosure yet Backbone (editorial) Extracted from annual reports (click an edge)
L4 Raw Materials & Substrates L3 Epi / Fab / OSAT L2 Dies & Chips L1 Modules & Engines L0 End Systems AI Server DC Switch Transceivers 10 companies Opt. Engine 8 companies SiPh Die 2 companies DFB Laser 7 companies Epi Wafer 2 companies III-V Foundry 1 company FAU 2 companies OSAT 3 companies GaAs Sub. InP Sub. MO Source Spec. Gas EIC Foundry 1 company ASIC Design 2 companies
L4 Raw Materials & Substrates L3 Epi / Fab / OSAT L2 Dies & Chips L1 Modules & Engines L0 End Systems AI Server DC Switch Transceivers 10 companies Opt. Engine 8 companies SiPh Die 2 companies DFB Laser 7 companies Epi Wafer 2 companies III-V Foundry 1 company FAU 2 companies OSAT 3 companies GaAs Sub. InP Sub. MO Source Spec. Gas EIC Foundry 1 company ASIC Design 2 companies

👆 Click an item to see its companies and annual-report sources; click an edge to see where the relation comes from.

Upstream items & companies

GaAs SubstrateL4・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

InP SubstrateL4・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Metalorganic PrecursorsL4・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Electronic Specialty GasesL4・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Compound Semi Epi WaferL3・Upstream

  • 🇹🇼 VPEC(2455) — 「10 FP/DFB LD 磊晶片」 Source: 2455 FY2025 annual report (Chinese original), section starting p.74
  • 🇹🇼 TrueLight(3234) — 「磊晶片生產流程 (MOCVD 磊晶 ) 晶圓生產流程 (Wafer」 Source: 3234 FY2025 annual report (Chinese original), section starting p.73

Compound Semi FoundryL3・Upstream

  • 🇹🇼 WIN(3105) — 「穩懋半導體致力於提供客戶最佳品質的三五族化合物半導體電路製程之晶圓」 Source: 3105 FY2024 annual report (Chinese original), section starting p.85

Wafer Foundry ServiceL3・Upstream

  • 🇹🇼 TSMC(2330) — 「台積公司提供全面整合的積體電路製造服務」 Source: 2330 FY2025 annual report (Chinese original), section starting p.51

Fiber Array Unit (FAU)L3・Upstream

  • 🇹🇼 Browave(3163) — 「(4) 晶圓級光纖陣列測試及封裝」 Source: 3163 FY2025 annual report (Chinese original), section starting p.63
  • 🇹🇼 APOGEE(6426) — 「2.FAU產品鍍膜開發成功」 Source: 6426 FY2025 annual report (Chinese original), section starting p.54

IC Packaging & Testing (OSAT)L3・Upstream

  • 🇹🇼 TSMC(2330) — 「完成認證CoWoS® 先進封裝解決 方案在5.5倍光罩尺寸中介層的認證」 Source: 2330 FY2025 annual report (Chinese original), section starting p.56
  • 🇹🇼 ELASER(3450) — 「功率半導體封裝及測試・AC/DC,DC/DC之交換式整流、轉換器之功能及」 Source: 3450 FY2025 annual report (Chinese original), section starting p.66
  • 🇹🇼 PTI(6239) — 「目前在 DRAM 、 NAND FLASH 之記憶體及邏輯 IC 之封測代工呈現約略各占 1/2 之態勢」 Source: 6239 FY2025 annual report (Chinese original), section starting p.80

DFB Laser DieL2・Upstream

  • 🇹🇼 VPEC(2455) — 「推出用於 AI 資料中心傳 輸之 CW-Laser(FP-LD 及 DFB-LD)」 Source: 2455 FY2025 annual report (Chinese original), section starting p.77
  • 🇹🇼 WIN(3105) — 「穩懋佈局以磷化銦 (InP) 或 GaAs 為基材之 PD 、 VCSEL 、 EML 及 CW DFB Laser 等相關技術開發」 Source: 3105 FY2025 annual report (Chinese original), section starting p.85
  • 🇹🇼 TrueLight(3234) — 「本公司基於垂直共振腔面射型雷射( VCSEL )、邊射型雷射( FP/DFB )以 及檢光二極體元件( GaAs PIN, InGaAs」 Source: 3234 FY2025 annual report (Chinese original), section starting p.73
  • 🇹🇼 ELASER(3450) — 「本公司之主要業務為雷射二極體產品、功率半導體產品之封裝測試代工服務」 Source: 3450 FY2025 annual report (Chinese original), section starting p.66
  • 🇹🇼 LuxNet(4979) — 「共同開發 CW DFB Laser 晶粒的研發及量產,目前 也已獲得數家主要客戶之肯定與採用」 Source: 4979 FY2025 annual report (Chinese original), section starting p.74
  • 🇺🇸 COHERENT CORP.(COHR) — 「We have in-house laser design and manufacturing capability for GaAs-based VCSELs, InP-based DMLs, EMLs, and CW lasers.」 Source: COHR FY2025 annual report (10-K/20-F)
  • 🇺🇸 Lumentum Holdings Inc.(LITE) — 「We also manufacture key components used in optical transceivers and data interconnect solutions, including high-speed laser transmitters, photonic integrated circuits, and photodiodes, high-power laser light sources, as well as VCSELs and VCSEL arrays for short-reach data transmission.」 Source: LITE FY2025 annual report (10-K/20-F)

ASIC Design ServiceL2・Upstream

  • 🇹🇼 GUC(3443) — 「本公司為客戶提供「一次購足」(one-stop shopping) 的服務,協助客戶在最短時間內完成「從設計概念到 產品量產上市」的全方位 SoC 解決方案」 Source: 3443 FY2025 annual report (Chinese original), section starting p.41
  • 🇺🇸 Marvell Technology, Inc.(MRVL) — 「Our current product offerings include custom Application Specific Integrated Circuits ("ASICs"), interconnects, ethernet solutions, fibre channel adapters, processors and storage controllers.」 Source: MRVL FY2026 annual report (10-K/20-F)

Electrical Control ICL2・Upstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Core items & companies

Silicon Photonics DieL2・Core

  • 🇺🇸 COHERENT CORP.(COHR) — 「Our portfolio also includes silicon photonics and a broad array of CPO-enabling technologies.」 Source: COHR FY2025 annual report (10-K/20-F)
  • 🇺🇸 Marvell Technology, Inc.(MRVL) — 「Our interconnect products include PAM (pulse amplitude modulation), coherent and coherent-lite DSPs (digital signal processors), laser drivers, TIAs (trans-impedance amplifiers), silicon photonics, CPO (co-packaged optics), LPO (linear pluggable optics) chipsets, DCI (data center」 Source: MRVL FY2026 annual report (10-K/20-F)

Optical EnginesL1・Core

  • 🇹🇼 TSMC(2330) — 「以及實現矽光子解決方案的緊湊通用光子引擎(COUPE)」 Source: 2330 FY2025 annual report (Chinese original), section starting p.51
  • 🇹🇼 TrueLight(3234) — 「包含磊晶、元件、次模組、光引擎 /AOC 等 型式之產品」 Source: 3234 FY2025 annual report (Chinese original), section starting p.65
  • 🇹🇼 PCL(4977) — 「而主要的光引擎已被應用在消費性電子產品。」 Source: 4977 FY2025 annual report (Chinese original), section starting p.50
  • 🇹🇼 LuxNet(4979) — 「建立 OEM/ODM 一站式代工服務, 100G~1.6T 光引擎及 CoC 封裝,與客戶深度合作開發」 Source: 4979 FY2025 annual report (Chinese original), section starting p.74
  • 🇹🇼 Lintes(6715) — 「本公司除基於高精度光學封裝製程及高性能光引擎設計能力,投入更多資源 於寬頻通訊應用之各式多模及單模矽光子光引擎與 3D 感測等領域之關鍵零組件 開發。」 Source: 6715 FY2025 annual report (Chinese original), section starting p.67
  • 🇺🇸 CIENA CORP(CIEN) — 「Nubis’s portfolio, including technologies for co-packaged optics, near packaged optics and electrical active copper cables, will complement our existing optical networking portfolio of high-speed interconnects.」 Source: CIEN FY2025 annual report (10-K/20-F)
  • 🇺🇸 Lumentum Holdings Inc.(LITE) — 「Beyond standard offerings, we deliver customized solutions tailored to specific customer needs, such as high-power laser sources, compact laser arrays, and advanced packaging schemes like co-packaged optics and integrated photonics assemblies.」 Source: LITE FY2025 annual report (10-K/20-F)
  • 🇺🇸 Marvell Technology, Inc.(MRVL) — 「Our interconnect products include PAM (pulse amplitude modulation), coherent and coherent-lite DSPs (digital signal processors), laser drivers, TIAs (trans-impedance amplifiers), silicon photonics, CPO (co-packaged optics), LPO (linear pluggable optics) chipsets, DCI (data center」 Source: MRVL FY2026 annual report (10-K/20-F)

Downstream items & companies

Optical TransceiversL1・Downstream

  • 🇹🇼 ELASER(3450) — 「高速傳輸光模組(含矽光子產品)・應用於資料中心、AI 運算、5G 通訊、HPC 與車用」 Source: 3450 FY2025 annual report (Chinese original), section starting p.66
  • 🇹🇼 APAC(4908) — 「本公司主要生產光纖通訊之主動元件及光纖傳輸收發模組」 Source: 4908 FY2025 annual report (Chinese original), section starting p.59
  • 🇹🇼 PCL(4977) — 「本集團擁有晶片直接封裝 (chip-on-board) 技術, 已成功開發超小型、低能量消耗的 SFP+ 插拔式光收發模組」 Source: 4977 FY2025 annual report (Chinese original), section starting p.50
  • 🇹🇼 LuxNet(4979) — 「共同合作開發元件、 光學次模組及光學收發模組等光通訊零組件,部分產品已通過一、二線設備 大廠的驗證並持續供貨中」 Source: 4979 FY2025 annual report (Chinese original), section starting p.90
  • 🇹🇼 EZconn(6442) — 「和實現 10G PON 與 25G PON 服務共存的 COMBO OLT Transceiver 等」 Source: 6442 FY2025 annual report (Chinese original), section starting p.94
  • 🇹🇼 Axcen(6530) — 「該產品依連接設備之接頭管腳排列區分為1x9、2x5 及2x10,傳輸速度介於100MB~1G,應用領域則視產品規格而有所不同,主要係網路電信。」 Source: 6530 FY2025 annual report (Chinese original), section starting p.98
  • 🇹🇼 Lintes(6715) — 「進一步開發出 PAM4 調變技術之 800G 等相關光電收發模組 及主動式高速連接線」 Source: 6715 FY2025 annual report (Chinese original), section starting p.58
  • 🇺🇸 CIENA CORP(CIEN) — 「We also offer specialized electrical and optical interconnect pluggables and other components, including new technology solutions from our acquisition of Nubis Communications, Inc. ("Nubis") during the fourth quarter of fiscal 2025.」 Source: CIEN FY2025 annual report (10-K/20-F)
  • 🇺🇸 COHERENT CORP.(COHR) — 「including significant investments in datacom transceivers for AI, indium phosphide and gallium arsenide semiconductor lasers, silicon carbide materials, and lasers for display processing, semiconductor capital equipment, and instrumentation.」 Source: COHR FY2025 annual report (10-K/20-F)
  • 🇺🇸 Lumentum Holdings Inc.(LITE) — 「Cloud Light designs, markets, and manufactures advanced optical modules for data center interconnect applications.」 Source: LITE FY2025 annual report (10-K/20-F)

AI ServersL0・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

Data Center SwitchesL0・Downstream

No collected annual-report disclosure for this item yet — the segment may be dominated by non-Taiwan or unlisted players, or not yet covered.

FAQ

Which listed companies are silicon photonics stocks plays?

Based on each company's own annual report disclosures, this map currently places 19 listed companies (Taiwan-listed 15, US-listed 4): TSMC(2330)、VPEC(2455)、WIN(3105)、Browave(3163)、TrueLight(3234)、GUC(3443)、ELASER(3450)、APAC(4908)、PCL(4977)、LuxNet(4979)、PTI(6239)、APOGEE(6426)、EZconn(6442)、Axcen(6530)、Lintes(6715)、CIENA CORP(CIEN)、COHERENT CORP.(COHR)、Lumentum Holdings Inc.(LITE)、Marvell Technology, Inc.(MRVL). A company's position is determined by the products its annual report says it makes — with the original excerpt cited.

What are CPO stocks?

"CPO stocks" usually refers to companies exposed to co-packaged optics — switch-adjacent optical engines replacing pluggable transceivers. On this map the core items are the silicon photonics die and the optical engine; companies up and down that chain are shown with their annual-report disclosures. Note that "CPO" has unrelated meanings elsewhere (chief product officer, certified pre-owned).

Where does the data on this map come from?

Two sources, styled differently on the map: relations tagged with a stock code are extracted from that company's annual report (click an edge to see the original Chinese excerpt and page); the backbone chain is an editorial framework that keeps the chain connected end-to-end. Company placements come 100% from disclosures — nothing is inferred.

Why do some items show no companies?

Dashed items have no collected annual-report disclosure yet — the segment may be dominated by non-Taiwan or unlisted players, or simply not yet covered. We deliberately distinguish "no companies" from "not yet covered".

Compiled from public annual-report disclosures for research and educational reference only — not investment advice or stock recommendations. The backbone chain is an editorial framework; company placements and code-tagged relations cite annual-report originals (in Chinese). Disclosures reflect their reporting period (FY2024 annual report, FY2025 annual report, FY2025 annual report, FY2026 annual report) and not current operations.
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